封装:
(45)
-(25)
Through Hole(293)
Board(1)
Solder(70)
100(3)
~(3)
Surface Mount(59)
`(1)
多选
包装:
(161)
-(1)
Tray(91)
Bulk(39)
Bag(75)
Box(1)
Tube(95)
Tape & Reel (TR)(2)
Tube, Rail(35)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    2.54毫米( .100 )间距SLA ?? ¢线对板头,扁平,表面贴装,单列,直角, 0.120口袋,带罩,带压入塑料钉, 2个电路 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits
    2178
    5-49
    14.4144
    50-199
    13.7984
    200-499
    13.4534
    500-999
    13.3672
    1000-2499
    13.2810
    2500-4999
    13.1824
    5000-7499
    13.1208
    ≥7500
    13.0592
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插件,表面贴装,双RowVertical堆叠,无铅, 100电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Plug, Surface Mount, Dual RowVertical Stacking, Lead-free, 100 Circuits
    4291
    1-9
    39.6988
    10-99
    37.4210
    100-249
    35.7289
    250-499
    35.4686
    500-999
    35.2083
    1000-2499
    34.9154
    2500-4999
    34.6551
    ≥5000
    34.4924
  • 描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插件,表面贴装,双RowVertical堆叠,无铅, 60电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Plug, Surface Mount, Dual RowVertical Stacking, Lead-free, 60 Circuits
    9333
    5-49
    24.7806
    50-199
    23.7216
    200-499
    23.1286
    500-999
    22.9803
    1000-2499
    22.8320
    2500-4999
    22.6626
    5000-7499
    22.5567
    ≥7500
    22.4508
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插件,表面贴装,双RowVertical堆叠,无铅, 40电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Plug, Surface Mount, Dual RowVertical Stacking, Lead-free, 40 Circuits
    7857
    5-49
    14.3559
    50-199
    13.7424
    200-499
    13.3988
    500-999
    13.3130
    1000-2499
    13.2271
    2500-4999
    13.1289
    5000-7499
    13.0676
    ≥7500
    13.0062
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.635 PITCH B- TO- B插头HSG盖组件-LEAD FREE- 0.635 PITCH B-TO-B PLUG HSG COVER ASSY -LEAD FREE-
    4839
    1-9
    56.9862
    10-99
    53.7165
    100-249
    51.2876
    250-499
    50.9139
    500-999
    50.5402
    1000-2499
    50.1198
    2500-4999
    49.7462
    ≥5000
    49.5126
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.635毫米( 0.025 “ )间距SlimStack ™接头,表面贴装,双排, VerticalStacking , 6.00和12.00毫米( 0.236和0.472 ” )堆叠高度,黑色,无铅, 60Circuits ,机器人放置金属盖,用浮雕胶带卷轴包装 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 6.00 and 12.00mm (.236 and .472") Stacking Heights, Black, Lead-free, 60Circuits, Robotic Placement Metal Cap, with Embossed Tape on Reel Packaging
    9954
    5-49
    24.3360
    50-199
    23.2960
    200-499
    22.7136
    500-999
    22.5680
    1000-2499
    22.4224
    2500-4999
    22.2560
    5000-7499
    22.1520
    ≥7500
    22.0480
  • 描述:
    2.54毫米( .100“ )间距SL头,单排,直角, 0.120 ”口袋,带罩,带压入塑料钉 2.54mm (.100") Pitch SL Header, Single Row, Right Angle, .120" Pocket, Shrouded, with Press-fit Plastic Peg
    3182
    5-49
    15.7833
    50-199
    15.1088
    200-499
    14.7311
    500-999
    14.6367
    1000-2499
    14.5422
    2500-4999
    14.4343
    5000-7499
    14.3669
    ≥7500
    14.2994
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单排,直角, 0.120 ”掌上, Shroudedwith压入塑料栓, 10电路, 0.38μm ( 15μ “),金(Au )选择性电镀,锡 2.54mm (.100") Pitch SL™ Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin
    1670
    10-99
    10.6440
    100-499
    10.1118
    500-999
    9.7570
    1000-1999
    9.7393
    2000-4999
    9.6683
    5000-7499
    9.5796
    7500-9999
    9.5086
    ≥10000
    9.4732
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    CONN RCPT 60POS 10.5MM 0.5MM SMD
    6349
    1-9
    48.0558
    10-99
    45.2985
    100-249
    43.2502
    250-499
    42.9351
    500-999
    42.6200
    1000-2499
    42.2655
    2500-4999
    41.9504
    ≥5000
    41.7534
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 50电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 50 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    7434
    5-49
    15.4908
    50-199
    14.8288
    200-499
    14.4581
    500-999
    14.3654
    1000-2499
    14.2727
    2500-4999
    14.1668
    5000-7499
    14.1006
    ≥7500
    14.0344
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 22电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 22 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    7810
    10-99
    8.7240
    100-499
    8.2878
    500-999
    7.9970
    1000-1999
    7.9825
    2000-4999
    7.9243
    5000-7499
    7.8516
    7500-9999
    7.7934
    ≥10000
    7.7644
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 3.50毫米( 0.138 ” )堆叠高度, 90电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 3.50mm (.138") Stacking Height, 90 Circuits
    2318
    1-9
    59.2020
    10-99
    56.6280
    100-249
    56.1647
    250-499
    55.8043
    500-999
    55.2380
    1000-2499
    54.9806
    2500-4999
    54.6203
    ≥5000
    54.3114
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排,垂直, 1.50毫米( .059 ” )堆叠高度,下围尺寸版本, 20电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical,1.50mm (.059") Stacking Height, Lower Circuit Size Version, 20 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    1581
    10-99
    8.9160
    100-499
    8.4702
    500-999
    8.1730
    1000-1999
    8.1581
    2000-4999
    8.0987
    5000-7499
    8.0244
    7500-9999
    7.9650
    ≥10000
    7.9352
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 3.50毫米( 0.138 ” )堆叠高度, 70电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 3.50mm (.138") Stacking Height, 70 Circuits
    8323
    5-49
    33.8598
    50-199
    32.4128
    200-499
    31.6025
    500-999
    31.3999
    1000-2499
    31.1973
    2500-4999
    30.9658
    5000-7499
    30.8211
    ≥7500
    30.6764
  • 描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排,垂直1.50毫米( .059 ” )堆叠高度,下围尺寸版本, 40电路,镀金镍屏障板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical 1.50mm (.059") Stacking Height, Lower Circuit Size Version, 40 Circuits, Gold Plating with Nickel Barrier Plating Between Contact and Tail
    7434
    5-49
    12.4839
    50-199
    11.9504
    200-499
    11.6516
    500-999
    11.5770
    1000-2499
    11.5023
    2500-4999
    11.4169
    5000-7499
    11.3636
    ≥7500
    11.3102
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 80电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 80 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    2943
    5-49
    25.7751
    50-199
    24.6736
    200-499
    24.0568
    500-999
    23.9026
    1000-2499
    23.7483
    2500-4999
    23.5721
    5000-7499
    23.4620
    ≥7500
    23.3518
  • 描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排,垂直1.50毫米( .059 ” )堆叠高度,下围尺寸版本, 60电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical 1.50mm (.059") Stacking Height, Lower Circuit Size Version, 60 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    3775
    5-49
    15.3153
    50-199
    14.6608
    200-499
    14.2943
    500-999
    14.2027
    1000-2499
    14.1110
    2500-4999
    14.0063
    5000-7499
    13.9409
    ≥7500
    13.8754
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    CONN RCPT 40POS VERT 0.5MM SMD
    5985
    5-49
    13.1742
    50-199
    12.6112
    200-499
    12.2959
    500-999
    12.2171
    1000-2499
    12.1383
    2500-4999
    12.0482
    5000-7499
    11.9919
    ≥7500
    11.9356
  • 描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 30电路,黄金Platingwith镍阻挡板之间的联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 30 Circuits, Gold Platingwith Nickel Barrier Plating Between Contact and Tail
    4647
    10-99
    8.8200
    100-499
    8.3790
    500-999
    8.0850
    1000-1999
    8.0703
    2000-4999
    8.0115
    5000-7499
    7.9380
    7500-9999
    7.8792
    ≥10000
    7.8498
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.5 B- TO -B CONN REC HOUSING组件( HGT - 1.5 ) ( 1页,共2 ) 0.5 B-TO-B CONN REC HOUSING ASSY (HGT-1.5) (SHEET 1 OF 2)
    4153
    5-49
    29.1330
    50-199
    27.8880
    200-499
    27.1908
    500-999
    27.0165
    1000-2499
    26.8422
    2500-4999
    26.6430
    5000-7499
    26.5185
    ≥7500
    26.3940
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 3.50毫米( 0.138 ” )堆叠高度, 120电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 3.50mm (.138") Stacking Height, 120 Circuits
    6694
    5-49
    34.9362
    50-199
    33.4432
    200-499
    32.6071
    500-999
    32.3981
    1000-2499
    32.1891
    2500-4999
    31.9502
    5000-7499
    31.8009
    ≥7500
    31.6516
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.50毫米( 0.020 “ )间距SlimStack ™插座,表面贴装,双排, Vertical1.50mm ( .059 ” )堆叠高度,下围尺寸版本, 16电路,金(Au)镀镍( Ni)的阻挡板之间联系和尾 0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical1.50mm (.059") Stacking Height, Lower Circuit Size Version, 16 Circuits, Gold (Au)Plating with Nickel (Ni) Barrier Plating Between Contact and Tail
    8950
    10-99
    8.2920
    100-499
    7.8774
    500-999
    7.6010
    1000-1999
    7.5872
    2000-4999
    7.5319
    5000-7499
    7.4628
    7500-9999
    7.4075
    ≥10000
    7.3799
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 3.50毫米( 0.138 ” )堆叠高度, 80电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 3.50mm (.138") Stacking Height, 80 Circuits
    9012
    5-49
    25.8804
    50-199
    24.7744
    200-499
    24.1550
    500-999
    24.0002
    1000-2499
    23.8454
    2500-4999
    23.6684
    5000-7499
    23.5578
    ≥7500
    23.4472
  • 描述:
    MINI MI2 REC 。组件( SN MINI MI2 REC. ASSY (SN
    8205
    10-99
    10.7880
    100-499
    10.2486
    500-999
    9.8890
    1000-1999
    9.8710
    2000-4999
    9.7991
    5000-7499
    9.7092
    7500-9999
    9.6373
    ≥10000
    9.6013
  • 描述:
    MINI MI2 REC 。组件( SN ) MINI MI2 REC. ASSY (SN)
    8804
    10-99
    6.5760
    100-499
    6.2472
    500-999
    6.0280
    1000-1999
    6.0170
    2000-4999
    5.9732
    5000-7499
    5.9184
    7500-9999
    5.8746
    ≥10000
    5.8526
  • 描述:
    MINI MI2 REC 。组件( SN ) MINI MI2 REC. ASSY (SN)
    8828
    5-24
    4.6170
    25-49
    4.2750
    50-99
    4.0356
    100-499
    3.9330
    500-2499
    3.8646
    2500-4999
    3.7791
    5000-9999
    3.7449
    ≥10000
    3.6936
  • 描述:
    MINI MI2 REC 。组件( SN ) MINI MI2 REC. ASSY (SN)
    3165
    5-24
    6.4800
    25-49
    6.0000
    50-99
    5.6640
    100-499
    5.5200
    500-2499
    5.4240
    2500-4999
    5.3040
    5000-9999
    5.2560
    ≥10000
    5.1840
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 4.00毫米( .157 ” )堆叠高度, 80电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 4.00mm (.157") Stacking Height, 80 Circuits
    8019
    1-9
    41.7484
    10-99
    39.3530
    100-249
    37.5736
    250-499
    37.2998
    500-999
    37.0260
    1000-2499
    36.7181
    2500-4999
    36.4443
    ≥5000
    36.2732
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    0.40毫米( 0.016 “ )间距板对板SlimStack ™插座,表面贴装, DualRow ,垂直叠加, 4.00毫米( .157 ” )堆叠高度, 120电路 0.40mm (.016") Pitch Board-to-Board SlimStack™ Receptacle, Surface Mount, DualRow, Vertical Stacking, 4.00mm (.157") Stacking Height, 120 Circuits
    1107
    1-9
    43.8224
    10-99
    41.3080
    100-249
    39.4402
    250-499
    39.1528
    500-999
    38.8654
    1000-2499
    38.5422
    2500-4999
    38.2548
    ≥5000
    38.0752
  • 品牌: Molex (莫仕)
    封装:
    Surface Mount
    描述:
    Conn Board to Board RCP 120POS 0.5mm Solder ST SMD Embossed T/R
    5048
    5-49
    33.3918
    50-199
    31.9648
    200-499
    31.1657
    500-999
    30.9659
    1000-2499
    30.7661
    2500-4999
    30.5378
    5000-7499
    30.3951
    ≥7500
    30.2524

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空